✓ NO MOQ Required
✓ IN-house Testing
✓ DFM SUpport
✓ 24/48H EXPRESS service
SOmething about PCB Manufacturing
01
Support a wide variety of PCB materials — including FR4, Alumina, High Tg, Copper Base, Low Loss, CEM-1, Halogen-Free, and Semiflex. Specific or custom materials are also available, ensuring we meet your unique product requirements.
02
Offer diverse manufacturing options including Heavy Copper, Blind & Buried Vias, High-Frequency, High-Speed, Embedded, Gold Finger, Impedance Control, and HDI PCBs — giving you the flexibility to match the exact requirements of your product.
03
Urgent 24/48-hour turnaround, support rapid prototyping to quick-turn services and full-scale production, we adapt our PCB manufacturing schedules to meet your timeline. Our flexible lead time ensures we deliver exactly meet your needs.
04
Whether it’s power, LED, control, medical, automotive, UPS, or industrial electronics — our PCB manufacturing spans across industries, ensuring reliable solutions tailored to diverse applications.
05
Every PCB is manufactured under strict quality control with 100% inhouse testing, include Visual Defects Inspection, Microsection, Flying Probe Testing, Soliderbility test, Inspect to IPC-A-600 Class 2 and IPC Class 3,
ensuring consistent performance, long-term reliability, and peace of mind for your products.
06
We provide comprehensive PCB DFM checks to prevent design issues early, no MOQ requirements to give you flexibility from prototypes to production, and design-to-manufacturing optimization to enhance efficiency and product performance.
We specialize in rapid PCB manufacturing with 24/48-hour turnaround options to keep your project moving. From IoT startups to industrial device makers, our customers count on us for precision, speed, and flexibility. Whether you need one prototype or thousands of production units, Helptron delivers high-quality PCBs — on time and on budget.
| Item | Standard | Limitation |
|---|---|---|
| Material | CEM-1/CEM-3/FR4 | High Frequency Series / High Tg |
| Layers | 2-14layers | 18Layers |
| Max Size | 580x620mm | 580x900mm |
| Finished Thickness | 0.4mm To 3.5mm | 0.3mm To 5.4mm |
| Copper Weight | 1/2oz To 3oz | 5oz |
| Wrapage | 0.75% (Max) | 0.5% |
| Impedance Tolerance | Natural Impedance +/- 10% DIfferential Impedance +/- 10% | Natural Impedance +/- 8% DIfferential Impedance +/- 8% |
| Surface Finished | LF HASL ENIG OSP Immersion Tin | Hybird Surface Treatment |
| Line Width/Space | > 1/2oz 3mil/3mil >1oz 5mil/5mil >2oz 7mil/7mil >3oz 9mil/9mil >4oz 11mil/11mil | > 1/2oz 2.5mil/2.5mil >1oz 4mil/4mil >2oz 5mil/5mil >3oz 8mil/8mil >4oz 10mil/10mil |
| Min Hole Diameter | 0.2mm | 0.15mm |
| Max Hole Diameter | 6.5mm | N/A |
| Hole Copper Thickness | 12um To 25um | Max 50um |
| Solder Mask | Green / Black / White / Blue / Red | Yellow /Coffee |
| Solder Mask Thickness | Line / copper surface 12um To 25um Line Angle 5um To 15um Base material position 18um To 35um | 10um To 28um 10um To 26um 35um |
| Min Solder Mask Bridge | Base Copper Thickness<H/Hoz, 2.5mil Base Copper Thickness<1/1oz, 3.5mil Base Copper Thickness <2/2oz, 1mil Base Copper Thickness <3/3oz, 5 mil | N/A |
| Overlay | Min width: 10mil Min Height: 30mil Min Overlay S/M Bridge: 6mil | N/A |
| Carbon Ink | Min Width: 14mil | 12mil |
| Lead Free HASL Thickness | 0.8um To 40um | 2.5um To 40um |
| ENIG Thickness | Nickel : 2.54um< Max<5um Gold: 0.025um<Max<0.05um | N/A |
| V-Cut Slot | Board Thickness:0.4mm< Max<3.0mm | 0.2mm<Max<5.0mm |
| Package | EPE Foam and Vacuum Packing | N/A |
Consult With Special Specs If The Table Below Can Not Meet Your Requirements.