Capablity
Our Box Build Capabilities
From simple mechanical builds to complex multi-level enclosures, our box build capabilities are tailored to meet your technical, compliance, and delivery needs, ensuring efficient, end-to-end integration.
01
System-Level Box Build Integration
We assemble complete products by integrating PCBs, wiring harnesses, displays, switches, fans, and electromechanical components into finished systems. Every assembly step is managed with an understanding of how components interact electrically, mechanically, and thermally—so issues are resolved before they reach final test or the field.
02
Enclosure Fabrication & Final Integration
We support the assembly of plastic, metal, and custom enclosures, including the installation of fasteners, gaskets, labels, and identification markings. Enclosures are treated as functional system elements, not cosmetic shells, ensuring fit, protection, and long-term durability.
03
Cable & Harness Installation
Cables and wire harnesses are routed, terminated, and secured with precision to match your mechanical layout and service requirements. All installations are verified for electrical integrity, reducing the risk of intermittent failures and assembly rework.
04
Electro-Mechanical Assembly Expertise
Our teams are experienced in managing tight tolerances, mixed-material interfaces, and thermal constraints commonly found in industrial and embedded systems. This allows us to build assemblies that remain stable across vibration, temperature variation, and extended operating life.
05
Custom Testing & Validation
Each box build program follows testing protocols tailored to your product configuration. Functional testing, continuity checks, and visual inspection are defined upfront to validate performance before shipment—not after deployment.
06
Inventory, Revision & Configuration Control
We support serialized tracking, revision control, and parallel management of multiple product variants. This ensures the correct components, firmware, and assemblies are built consistently across batches and lifecycle stages.
07
Final Packaging & Logistics Readiness
Products are delivered fully assembled, labeled, and packaged according to your shipping and branding requirements. We support ready-to-ship fulfillment and coordinated logistics to simplify downstream operations.
08
Turnkey Program Ownership
Box build assembly at Helptron is not a standalone service. We manage the full lifecycle—from design coordination and material sourcing to assembly, testing, and delivery—so you have a single manufacturing system instead of multiple disconnected suppliers.
Testing & Quality
Testing at Helptron is not an isolated checkpoint — it is part of a controlled manufacturing system. The result is fewer surprises during final integration, higher first-pass yield, and confidence that your product is ready for real-world use.
Advanced Testing for Maximum Reliability
- Flying Probe Testing
Fast, fixtureless testing ideal for prototypes. - In-Circuit Testing (ICT)
Verifies component placement and function using Teradyne, HP, and GenRad systems. - Functional Testing
Simulates real-world operation to ensure system readiness. - Boundary Scan Testing
Non-intrusive diagnostics for high-density boards. - Burn-In Testing
Identifies early component failures under thermal/electrical stress. - Ionic Contamination Testing
Ensures board cleanliness for long-term reliability. - Component Programming
In-house programming for ICs and embedded devices. - Custom Fixture & Software Development
In-house test development for faster deployment.
Quality at Every Step
- Built-In Quality Control, Not After-the-Fact Inspection
Quality is controlled at every production stage through defined inspection gates and real-time process monitoring — preventing defects instead of reacting to them later. - Multi-Layer Testing Coverage
A combination of flying probe, in-circuit, boundary scan, and functional testing is applied based on product risk and complexity, ensuring electrical and functional integrity before shipment. - Certified Workmanship Standards
Assemblers and inspectors are trained and certified to ensure consistent workmanship across all builds and production volumes. - Full Traceability & Process Documentation
From materials to finished assemblies, every build is traceable with clear documentation — supporting audits, failure analysis, and long-term quality accountability. - Data-Driven Continuous Improvement
Lean manufacturing principles and Six Sigma methodologies are applied to analyze yield, reduce variation, and improve process stability over time.
Helptron Support
Rapid Prototyping
Prototypes are functional pre-production samples that test your product’s real-world performance. Using varied assembly methods post-design, they validate both the core concept and manufacturing feasibility.
Our prototypes are built for mass production. We prioritize sustainable material/component availability to control costs and enforce rigorous SOPs – ensuring your final product delivers uncompromised quality and consistency. Proactive supply chain oversight eliminates bottlenecks for reliable delivery.
After prototype completion, we analyze results to recommend design optimizations and cost-saving adjustments, utilizing deep expertise to bridge prototyping and production smoothly.
Typical Prototyping Stages
Proto Engineering & Documentation
This initial phase involves designing the prototype’s technical specifications and creating detailed plans (drawings, BOMs, instructions) to guide its construction
PCB Manufacturing & Component Procurement
Manufacturing all necessary printed circuit boards (PCBs) and acquiring electronic/mechanical components required to build the functional prototype
Production Fabrication
The physical manufacturing process where the prototype’s parts (e.g., custom enclosures, brackets, PCBs) are created using techniques like machining, 3D printing, or molding.
Mechanical Prototype Assembly
Bringing together all fabricated parts and procured components to physically build the working prototype unit according to the engineering documentation
Quality Control Checks
Rigorous testing and inspection of the assembled prototype against design specifications and functional requirements to identify any defects or performance issues
Improvement Recommendations
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Rebuild of Further Prototypes (if required)
Creating updated prototype iterations, incorporating the recommended improvements to validate changes before finalizing the design for production
Box Build Assembly
Box Build assembly is the process of putting the manufactured parts together to form your product. It is an important part of electronic manufacturing, and getting it right is critical to your success. We follow detailed work instructions and employ specific engineering techniques to ensure a cost-effective and on-time solution.
Typical Box Build Stages
Production Engineering & Planning
Technical preparation: Defining assembly processes, equipment requirements, and workflow sequencing to ensure manufacturability.
Work Order & SOP Creation
Documentation phase: Generating task-specific production orders and detailed Standard Operating Procedures (SOPs) for operator guidance.
BOM Check
Material validation: Verifying the Bill of Materials (BOM) against physical components for accuracy, revision control, and availability.
SOP Validation
Procedure validation: Confirming SOPs align with design specifications and production capabilities before release.
Component Bake
Moisture prevention: Baking humidity-sensitive components (e.g., BGAs) to remove trapped moisture and prevent “popcorning” during soldering.
SMD Pick and Place Loading
Automated placement: Robotic assembly of Surface Mount Devices (SMDs) onto PCB pads with micron-level precision.
AOI Inspection (QC1)
Automated optical check: Machine vision verifies component placement accuracy, polarity, and solder paste quality post-reflow.
X-Ray Inspection (Optional)
Hidden joint analysis: Non-destructive inspection of solder connections under components (e.g., BGAs, QFNs) for voids or bridging.
THD Component Loading
Through-hole insertion: Manual or automated installation of leaded components into plated through-holes.
PCB Cleaning
Post-solder cleaning: Removing flux residues and ionic contaminants to prevent corrosion and ensure electrical reliability.
Enhanced Vision Inspection (QC2)
Manual verification: Technicians using magnification tools inspect solder joints, component orientation, and workmanship standards.
Microprocessor Programming
Creating updated prototype iterations, incorporating the recommended improvements to validate changes before finalizing the design for production
Electrical Testing
Functional validation: Power-on tests, in-circuit testing (ICT), or boundary scans verify electrical performance and specifications.
HD Vision Inspection (QC3)
Final optical QA: High-definition automated or manual inspection for micro-defects before final assembly
X-Ray Inspection (Optional)
Secondary validation: Repeat X-ray for critical applications or after rework to ensure joint integrity.
Conformal Coating (Optional)
Environmental protection: Applying thin acrylic/polyurethane film to shield PCBs from moisture, chemicals, and contaminants
Box Build Assembly
Integration: Mounting PCBs into enclosures, attaching heatsinks, PEM inserts, spacers, and connectors.
SOP Documentation Update
Continuous improvement: Revising work instructions based on production feedback, design changes, or process optimizations.
Packaging for Delivery
Shipment preparation: ESD-safe wrapping, humidity control, and customized packaging for secure transit.