
✓ Wide Range FPC Production ✓ NO MOQ Required ✓ IN-house Testing
✓ DFM Support ✓ 24/48H EXPRESS service
Also known as a flex circuit, it is a type of electronic interconnect that uses a flexible plastic substrate, typically polyimide(PI) or polyester(PET) instead of the rigid fiberglass(FR4) used in traditional PCBs. This allows the circuit to bend, fold, and twist into complex three-dimensional shapes or move dynamically during operation.
Offers versatile manufacturing of various FPC types (single-layer to rigid-flex) from prototyping to mass production, supporting orders as small as 1 piece with no MOQ limits.
Provides reliable FPCs for diverse sectors like wearables, smartphones, medical devices, automotive systems, and industrial sensors to meet industry-specific needs.
Ensures strict control over layers (1-6), sizes (up to 250×600mm), hole diameters (0.15-0.2mm), line widths/spacing, and other critical production parameters.
Delivers multiple surface finishes (Ni-Au, Sn, OSP) with defined thickness ranges for nickel, gold, and tin layers to suit different application requirements.
Supplies end-to-end assembly support, customization options (outlines, panelization), and enhancements like stiffeners and EMI solutions.
Offers flexible lead times (3-12 working days) with expedited options, plus 100% after-sales support and pre-production samples for quality verification.
From rapid prototypes to production-ready FPCB ( Flexible Printed Circuits), Helptron Electronics provides end-to-end FPC manufacturing with speed, precision, and full material flexibility. Our FPCs power products across wearables, medical devices, consumer tech, industrial sensors, and more.
| Items | Standard | Limitation | |
| Layers | 1-4L | 6L | |
| Max Size | 250*300 | 250*600 | |
| Min Hole Size | 0.2 | 0.15 | |
| Hole Position Tolerance | +- 0.05mm | +- 0.03mm | |
| Hole Wall CU Thickness | 8um To 12um | 15um To 20um | |
| Line Width / Space | 1/3oz: 2.4mil/2.4mil 1/2oz: 3.0mil/3.0mil 1/1oz: 4.0mil/4.0mil 2oz: 6mil/6mil | 2mil/mil 2.4mil/2.4mil 3mil/3mil 4mil/4mil | |
| Trace-to-Board-Edge Distance | 0.2mm | 0.15mm | |
| Coverlay Registration Tolerance | 0.2mm | 0.15mm | |
| Coverlay Openning-to-Trace Spacing | 0.1mm | 0.05mm | |
| Adhesive Squeeze-Out | 0.15mm | 0.05mm | |
| Stiffener Registration Tolerance | +- 0.25mm | +- 0.15mm | |
| Legend | Min Width: 0.15mm Min Height: 1.0mm Shift Tolerance:+-0.3mm | 0.12mm 0.8mm +-0.2mm | |
| Surface Treatment | Deposition Ni-Au Electroplate Ni-AU Electroplate Sn OSP | Ni80-200uinch/Au1-3uinch Ni80-240uinch/Au1-3uinch 100-1000uinch 0.2-0.5um | Ni80-100uinch/Au 4uinch Ni80-120uinch/Au1-50uinch 100-150uinch 0.5-1.0um |
| Steel Rule Die Tolerance | +-0.3mm | +-0.2mm | |
| Hard Tooling Tolerance | +-0.1mm | +-0.05mm | |
| Gold Finger Shift Tolerance | +-0.1 | +-0.05 |
Consult With Special Specs If The Table Above Can Not Meet Your Requirements.







