
Let us take your electronic design across the finish line. Helptron provides professional, flexible, and scalable SMT, THT, box build, and cable assembly services — under one roof.
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A turnkey service means to provide a fully functional or completed product that can be immediately used after receiving
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Box Build Assembly is a systems integration assembly in which a product can be done from start to finish— from conception to electronics assembly contained in a final enclosure.
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To avoid bad quality products, PCB functional testing is undoubtedly a part that cannot be skipped,which make sure each device pass before box assembly.
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IC programming is the process of writing instructions or data into an integrated circuit (IC), also known as a microchip or chip, to enable it to perform a specific function
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To fulfill your design requirements, We provide one-stop customization services, as Machining/Punching holes/cuts, printing, overlay manufacturing, painting or color anodization.
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PCBA testing is a critical part of the electronics manufacturing process, ensuring that your printed circuit boards assembly meets required specifications and functions correctly. Custom test jig will provent quality issue from production.
Prototypes are functional pre-production samples that test your product’s real-world performance. Using varied assembly methods post-design, they validate both the core concept and manufacturing feasibility.
Our prototypes are built for mass production. We prioritize sustainable material/component availability to control costs and enforce rigorous SOPs – ensuring your final product delivers uncompromised quality and consistency. Proactive supply chain oversight eliminates bottlenecks for reliable delivery.
After prototype completion, we analyze results to recommend design optimizations and cost-saving adjustments, utilizing deep expertise to bridge prototyping and production smoothly.
This initial phase involves designing the prototype’s technical specifications and creating detailed plans (drawings, BOMs, instructions) to guide its construction.
Manufacturing all necessary printed circuit boards (PCBs) and acquiring electronic/mechanical components required to build the functional prototype.
The physical manufacturing process where the prototype’s parts (e.g., custom enclosures, brackets, PCBs) are created using techniques like machining, 3D printing, or molding.
Bringing together all fabricated parts and procured components to physically build the working prototype unit according to the engineering documentation.
Rigorous testing and inspection of the assembled prototype against design specifications and functional requirements to identify any defects or performance issues.
Providing expert analysis based on testing results and assembly experience, suggesting design optimizations, cost reductions, or manufacturability enhancements.
Creating updated prototype iterations incorporating the recommended improvements to validate changes before finalizing the design for production.
Precision PCB Assembly: An Integrated Process
Printed Circuit Board assembly integrates multiple fabrication stages into a unified workflow, where seamless coordination between each phase is critical. Prior to production commencement, we establish comprehensive Standard Operating Procedures (SOPs) that define all work instructions, ensuring synchronized transitions between processes and guiding your product through every work center with precision.
Optimized Manufacturing Execution
The process initiates with accurate SMD board printing using stainless steel stencils in our automated in-line paste printers. Component placement is executed by state-of-the-art pick-and-place robotics, guaranteeing micron-level accuracy. Controlled reflow soldering is achieved through advanced vapor phase techniques, followed by rigorous Automated Optical Inspection (AOI) for 100% quality verification – validating component polarity, values, and solder joint integrity. Post-assembly, PCBs undergo thorough washing to eliminate flux residues and contaminants.
Comprehensive Quality Verification
Our quality control employs benchtop optical inspection stations, high-magnification microscopes, and benched HD vision systems for surface analysis. For subsurface evaluation, a 100KV X-ray machine with 130x magnification and 5-micron focal spot enables critical inspections: BGA/Micro BGA component analysis, PCB cross-sectioning, internal wire connection verification, void-to-pad ratio quantification, and structural fracture detection. Customized reports document all findings.
Specialized Value-Added Services
We offer Chip-on-Board (COB) epoxy encapsulation for component anchoring, IP protection, or rigidity enhancement. Acrylic conformal coating safeguards boards operating in corrosive, humid, or hazardous environments. Additional services include mechanical PCB installation into enclosures, heatsink integration, and assembly of Pemserts®, spacers, and mounting hardware.
Technical preparation: Defining assembly processes, equipment requirements, and workflow sequencing to ensure manufacturability.
Documentation phase: Generating task-specific production orders and detailed Standard Operating Procedures (SOPs) for operator guidance.
Material validation: Verifying the Bill of Materials (BOM) against physical components for accuracy, revision control, and availability.
Procedure validation: Confirming SOPs align with design specifications and production capabilities before release.
Moisture prevention: Baking humidity-sensitive components (e.g., BGAs) to remove trapped moisture and prevent “popcorning” during soldering.
Automated placement: Robotic assembly of Surface Mount Devices (SMDs) onto PCB pads with micron-level precision.
Automated optical check: Machine vision verifies component placement accuracy, polarity, and solder paste quality post-reflow.
Hidden joint analysis: Non-destructive inspection of solder connections under components (e.g., BGAs, QFNs) for voids or bridging.
Through-hole insertion: Manual or automated installation of leaded components into plated through-holes.
Post-solder cleaning: Removing flux residues and ionic contaminants to prevent corrosion and ensure electrical reliability.
Manual verification: Technicians using magnification tools inspect solder joints, component orientation, and workmanship standards.
Creating updated prototype iterations incorporating the recommended improvements to validate changes before finalizing the design for production.
Functional validation: Power-on tests, in-circuit testing (ICT), or boundary scans verify electrical performance and specifications.
Final optical QA: High-definition automated or manual inspection for micro-defects before final assembly.
Secondary validation: Repeat X-ray for critical applications or after rework to ensure joint integrity.
IP protection: Dispensing epoxy resin over chips to conceal circuitry, prevent reverse engineering, or enhance mechanical stability.
Environmental protection: Applying thin acrylic/polyurethane film to shield PCBs from moisture, chemicals, and contaminants.
Integration: Mounting PCBs into enclosures, attaching heatsinks, PEM inserts, spacers, and connectors.
Continuous improvement: Revising work instructions based on production feedback, design changes, or process optimizations.
Shipment preparation: ESD-safe wrapping, humidity control, and customized packaging for secure transit.
A: Our triple-inspection system guarantees reliability:
-100% Automated Optical Inspection (AOI) coverage
-HD visual manual re-inspection (20x magnifiers + microscopes)
-Critical-point X-ray verification (≤5% BGA void ratio)
-Standardized SOPs maintain <0.1% defect rate across batches
-Functional Testing on your standard
A: Staged Delivery Program:
-Requires advance notice in SOW (Statement of Work)
-30% quantity shipment at 60% production completion
-OCM (Original Component Manufacturer) direct purchasing
A: Identical quality standards apply:
-Complimentary first-article functional test report.
-Same SOPs and inspection equipment
-Dedicated micro-production lines
On-demand solutions:
–Ceramic substrates: Available for high-temp applications
–Conformal coating: >500hrs salt spray resistance
–COB encapsulation: -40℃~125℃ thermal cycle certified
A: Escalation Protocol:
-Immediate freeze of production upon detection.
-Zero charges for errors caused by our DFM oversight
-Engineering review within 4 business hours
At Helptron, we are dedicated to delivering exceptional electronic manufacturing solutions. Our commitment to quality and innovation drives us to work closely with clients, ensuring that every project reflects our attention to detail and expertise. From the initial design phase to the final assembly, we prioritize your needs and strive to exceed expectations.
Whether you require FPC or Rigid PCB for consumer electronics, automotive applications, or industrial devices, we are here to support you every step of the way. Experience the synergy of advanced technology and personalized service with Helptron.